Lau, John H. <br/><br/>
Low cost flip chip technologies :  for DCA, WLSCP, and PBGA assemblies / 
John H. Lau. 
 - New York :  McGraw-Hill,  c2000. 
 - xxii, 585p. : ill. ; 24 cm. 
<br/><br/> Includes references at the end of each chapter. 
<br/><br/><label>ISBN: </label>0071351418 hard bound 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Multichip modules (Microelectronics)--Design and construction.<br/>Microelectronic packaging.