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Low cost flip chip technologies : for DCA, WLSCP, and PBGA assemblies / John H. Lau.
Material type:
TextPublication details: New York : McGraw-Hill, c2000.Description: xxii, 585p. : ill. ; 24 cmISBN: - 0071351418 hard bound
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Ladislao N. Diwa Memorial Library Room Use Section | 20030408 | TK7874 | Available | mma | 15059 |
Includes references at the end of each chapter.