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	1.	Low cost flip chip technologies : for DCA, WLSCP, and PBGA assemblies / John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2000 Availability: Items available for loan: (1). Add to cart (remove)
	2.	Low cost flip chip technologies : for DCA, WLSCP, and PBGA assemblies / John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2000 Availability: No items available. Add to cart (remove)
	3.	Low cost flip chip technologies : for DCA, WLSCP, and PBGA assemblies / John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2000 Availability: No items available. Add to cart (remove)

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